DocumentCode

1924605

Title

Flip Chip Solder Bumping Using Solder Pastes

Author

Elenius, Peter

fYear

1997

fDate

16-18 April 1997

Firstpage

116

Lastpage

121

Keywords

Copper; Flip chip; Lead; Metallization; Ohmic contacts; Passivation; Protection; Robustness; Silicon; Tin;

fLanguage

English

Publisher

ieee

Conference_Titel

IEMT/IMC Symposium, 1997., 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]

Conference_Location

IEEE

Print_ISBN

0-7803-4235-6

Type

conf

Filename

618989