مرکز منطقه ای اطلاع رساني علوم و فناوري - Flip Chip Solder Bumping Using Solder Pastes

DocumentCode :

1924605

Title :

Flip Chip Solder Bumping Using Solder Pastes

Author :

Elenius, Peter

fYear :

1997

fDate :

16-18 April 1997

Firstpage :

116

Lastpage :

121

Keywords :

Copper; Flip chip; Lead; Metallization; Ohmic contacts; Passivation; Protection; Robustness; Silicon; Tin;

fLanguage :

English

Publisher :

ieee

Conference_Titel :

IEMT/IMC Symposium, 1997., 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]

Conference_Location :

IEEE

Print_ISBN :

0-7803-4235-6

Type :

conf

Filename :

618989

Link To Document :