• DocumentCode
    1924804
  • Title

    A least-norm approach to flattenable mesh surface processing

  • Author

    Wang, Charlie C.L.

  • Author_Institution
    Dept. of Mech. & Autom. Eng., Chinese Univ. of Hong Kong, Hong Kong
  • fYear
    2008
  • fDate
    4-6 June 2008
  • Firstpage
    131
  • Lastpage
    138
  • Abstract
    Following the definition of developable surface in differential geometry, the flattenable mesh surface, a special type of piecewise- linear surface, inherits the good property of developable surface about having an isometric map from its 3D shape to a corresponding planar region. Different from the developable surfaces, a flattenable mesh surface is more flexible to model objects with complex shapes (e.g., cramped paper or warped leather with wrinkles). Modelling a flattenable mesh from a given input mesh surface can be completed under a constrained nonlinear optimization framework. In this paper, we reformulate the problem in terms of estimation error. Therefore, the shape of a flattenable mesh can be computed by the least-norm solutions faster. Moreover, the method for adding shape constraints to the modelling of flattenable mesh surfaces has been exploited. We show that the proposed method can compute flattenable mesh surfaces from input piecewise linear surfaces successfully and efficiently.
  • Keywords
    computer graphics; differential geometry; mesh generation; optimisation; differential geometry; flattenable mesh surface processing; nonlinear optimization; piecewise-linear surface; Footwear industry; Manufacturing industries; Metal product industries; Metals industry; Piecewise linear techniques; Shape; Shipbuilding industry; Solid modeling; Textile industry; Toy industry; I.3.5 [Computational Geometry and Object Modeling]: Curve surface, solid, and object representations—Physically based modeling; J.6 [COMPUTER-AIDED ENGINEERING]: Computer-aided design (CAD)—Computer-aided design (CAD);
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Shape Modeling and Applications, 2008. SMI 2008. IEEE International Conference on
  • Conference_Location
    Stony Brook, NY
  • Print_ISBN
    978-1-4244-2260-9
  • Electronic_ISBN
    978-1-4244-2261-6
  • Type

    conf

  • DOI
    10.1109/SMI.2008.4547959
  • Filename
    4547959