DocumentCode :
1925438
Title :
1700 V-IGBT3: field stop technology with optimized trench structure $trend setting for the high power applications in industry and traction
Author :
Pfaffenlehner, M. ; Laska, T. ; Mallwitz, R. ; Mauder, A. ; Pfirsch, F. ; Schaeffer, C.
Author_Institution :
Infineon Technol. AG, Muenchen, Germany
fYear :
2002
fDate :
2002
Firstpage :
105
Lastpage :
108
Abstract :
The IGBT3 technology, which combines a specific trench cell and the field stop concept, was first introduced for devices with 1200 V blocking voltage. It is now transferred to higher blocking voltage ratings. A new series of 1700 V devices is introduced, which compared with conventional NPT (= non punch through) devices has greatly reduced static and dynamic losses and preserves the well known ruggedness of NPT devices. With this new 1700 V chip generation a new product line of modules with up to 50% higher current capability in the same housing is available.
Keywords :
insulated gate bipolar transistors; isolation technology; losses; modules; power bipolar transistors; semiconductor device manufacture; semiconductor device packaging; 1200 V; 1700 V; IGBT specific trench cell; IGBT3 field stop technology; NPT device ruggedness; device blocking voltage rating; dynamic losses; field stop concept; high power industrial applications; high power traction applications; module current capability; module housing; module product line; nonpunch through devices; optimized trench structure; static losses; Conductivity; Current density; Insulated gate bipolar transistors; Switching loss; Temperature; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Power Semiconductor Devices and ICs, 2002. Proceedings of the 14th International Symposium on
Print_ISBN :
0-7803-7318-9
Type :
conf
DOI :
10.1109/ISPSD.2002.1016182
Filename :
1016182
Link To Document :
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