DocumentCode

1926249

Title

Thermal analysis of a suspension with an IC-chip

Author

Nomura, I. ; Takano, K. ; Sat, I.

Author_Institution

TDK Corporation

fYear

1999

fDate

18-21 May 1999

Keywords

Heat transfer; Power dissipation; Solid modeling; Temperature; Thermal stresses;

fLanguage

English

Publisher

ieee

Conference_Titel

Magnetics Conference, 1999. Digest of INTERMAG 99. 1999 IEEE International

Conference_Location

Kyongju, Korea

Print_ISBN

0-7803-5555-5

Type

conf

DOI

10.1109/INTMAG.1999.837413

Filename

837413