Title :
Reliability of pressure contacted intelligent integrated power modules
Author :
Scheuermann, Uwe
Author_Institution :
Semikron Elektron. GmbH, Nuremberg, Germany
Abstract :
The pressure contact concept offers new opportunities for an advanced power module package technology. It is flexible with respect to the substrate size or material and it enables progress in system architecture by integration of intelligence and additional functions. The reliability of the pressure contact module is superior to the state-of-the-art base plate module. The load cycle lifetime exceeds the data known for base plate modules and improves the predictability due to a defined end-of-life limit.
Keywords :
electrical contacts; insulated gate bipolar transistors; life testing; mechanical contact; modules; power bipolar transistors; semiconductor device packaging; semiconductor device reliability; semiconductor device testing; thermal management (packaging); IGBT module; base plate modules; end-of-life limit predictability; flexible construction; integrated intelligence system architecture; intelligent power module reliability; load cycle lifetime; module functions; power module package technology; power semiconductor packages; pressure contact concept; pressure contacted intelligent integrated power modules; substrate material; substrate size; Ceramics; Circuits; Contacts; Heat sinks; Intelligent sensors; Multichip modules; Power system reliability; Semiconductor device packaging; Substrates; Temperature sensors;
Conference_Titel :
Power Semiconductor Devices and ICs, 2002. Proceedings of the 14th International Symposium on
Print_ISBN :
0-7803-7318-9
DOI :
10.1109/ISPSD.2002.1016218
