Design trade-off for resonance reduction of multiple power planes in Super Ball Grid Array (SBGA) package

Author

Kim, Gawon ; Lee, SeungJae ; Yu, Jiheon ; Misman, Ozgur ; Bae, KiCheol ; Kim, TaeKi ; Lee, Sangwoong ; Kim, JinYoung

Author_Institution

Amkor Technol. Korea, Seoul, South Korea

fYear

2010

fDate

24-26 Aug. 2010

Firstpage

1

Lastpage

4

Abstract

In this paper, package co-design procedure with electrical simulation supported by Amkor Technology will be described and design trade-off for effective power/ground plane design in SBGA package will be discussed. Two models of SBGA design, which has five kinds of main and sub-main power nets, are compared using 3D electromagnetic (EM) simulation tool. By comparison of both design, inevitable design trade-off for effective multiple power planes will be presented and discussed from power integrity (PI) viewpoint. The revised SBGA package design was implemented and measured to analyze plane resonances in the impedance profile of each power/ground planes according to frequencies up to 10 GHz so that the simulated self-impedances can be compared with measured results.

Keywords

ball grid arrays; electric impedance; design trade-off; electrical simulation; electromagnetic simulation tool; multiple power planes; package co-design procedure; resonance reduction; simulated self-impedances; super ball grid array package; Electronics packaging; Frequency measurement; Impedance; Power measurement; Resonant frequency; Silicon; Solid modeling;

fLanguage

English

Publisher

ieee

Conference_Titel

CPMT Symposium Japan, 2010 IEEE

Conference_Location

Tokyo

Print_ISBN

978-1-4244-7593-3

Type

conf

DOI

10.1109/CPMTSYMPJ.2010.5679670

Filename

5679670