Title :
A stopband enhanced EBG power/ground plane based on via location design
Author :
Wang, Chuen-De ; Wu, Tzong-Lin
Author_Institution :
Dept. of Electron. Eng., Nat. Taiwan Univ., Taipei, Taiwan
Abstract :
A novel electromagnetic bandgap (EBG) structure power/ground plane by using multilayer stack-up structure and multiple vias is proposed. A wide stopband exhibited by the proposed EBG structure is used to suppress the power noise coupling between power/ground plane in the package. Both the upper and lower side cutoff frequencies are enhanced through the via connection and location design. A simplified one-dimensional equivalent model is established to explain the concept of the stopband enhancement. Different via position and the resultant bandgap variation are demonstrated by both dispersion diagram and S-parameter.
Keywords :
S-parameters; electronics packaging; photonic band gap; S-parameter; bandgap variation; cutoff frequencies; dispersion diagram; electromagnetic bandgap structure; multilayer stack-up structure; one-dimensional equivalent model; power noise suppression; stopband enhanced EBG power-ground plane; via connection design; via location design; via position; Bandwidth; Cutoff frequency; Metamaterials; Noise; Periodic structures; Power transmission lines; Resonant frequency;
Conference_Titel :
CPMT Symposium Japan, 2010 IEEE
Conference_Location :
Tokyo
Print_ISBN :
978-1-4244-7593-3
DOI :
10.1109/CPMTSYMPJ.2010.5679674
