A stopband enhanced EBG power/ground plane based on via location design

Author

Wang, Chuen-De ; Wu, Tzong-Lin

Author_Institution

Dept. of Electron. Eng., Nat. Taiwan Univ., Taipei, Taiwan

fYear

2010

fDate

24-26 Aug. 2010

Firstpage

1

Lastpage

4

Abstract

A novel electromagnetic bandgap (EBG) structure power/ground plane by using multilayer stack-up structure and multiple vias is proposed. A wide stopband exhibited by the proposed EBG structure is used to suppress the power noise coupling between power/ground plane in the package. Both the upper and lower side cutoff frequencies are enhanced through the via connection and location design. A simplified one-dimensional equivalent model is established to explain the concept of the stopband enhancement. Different via position and the resultant bandgap variation are demonstrated by both dispersion diagram and S-parameter.

Keywords

S-parameters; electronics packaging; photonic band gap; S-parameter; bandgap variation; cutoff frequencies; dispersion diagram; electromagnetic bandgap structure; multilayer stack-up structure; one-dimensional equivalent model; power noise suppression; stopband enhanced EBG power-ground plane; via connection design; via location design; via position; Bandwidth; Cutoff frequency; Metamaterials; Noise; Periodic structures; Power transmission lines; Resonant frequency;

fLanguage

English

Publisher

ieee

Conference_Titel

CPMT Symposium Japan, 2010 IEEE

Conference_Location

Tokyo

Print_ISBN

978-1-4244-7593-3

Type

conf

DOI

10.1109/CPMTSYMPJ.2010.5679674

Filename

5679674