• DocumentCode
    1927023
  • Title

    Application of Matrix pencil method in sub-cycle voltage dip classification

  • Author

    Meng Hwee Chia ; Khambadkone, Ashwin M.

  • Author_Institution
    Nat. Univ. of Singapore, Singapore, Singapore
  • fYear
    2013
  • fDate
    15-19 Sept. 2013
  • Firstpage
    2245
  • Lastpage
    2252
  • Abstract
    Matrix Pencil Method (MPM) has been applied to sub-cycle information of space vector and zero-sequence voltage to classify voltage dip phenomena. The feature extraction performance of MPM using different sampling window width has been statistically analyzed and found to perform relatively well between 0.1 and 1 cycle of a damped complex sinusoidal signal. The results show that MPM is able to estimate the fundamental frequency space vector even in highly distorted signals. The space vector ellipse´s estimation is further enhanced by augmenting an ellipse fitting algorithm to MPM. This enhanced method differentiated between two highly similar two-phase voltage dips using only a quarter-cycle of data, demonstrating the feasibility of this scheme. This is demonstrated in a fault simulation on IEEE 34-bus system using a 5 ms sampling window.
  • Keywords
    distributed power generation; feature extraction; power generation faults; power supply quality; signal classification; signal sampling; IEEE 34-bus system; MPM; damped complex sinusoidal signal; data quarter-cycle; distributed energy resource; ellipse fitting algorithm; feature extraction performance; fundamental frequency space vector estimation; matrix pencil method; power network; power quality disturbances; sampling window width; space vector voltage; subcycle information; subcycle voltage dip classification; voltage dip phenomena; zero-sequence voltage; Boolean functions; Data structures; Equations; Mathematical model; Silicon; Support vector machine classification; Voltage fluctuations;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Energy Conversion Congress and Exposition (ECCE), 2013 IEEE
  • Conference_Location
    Denver, CO
  • Type

    conf

  • DOI
    10.1109/ECCE.2013.6646986
  • Filename
    6646986