DocumentCode
1927034
Title
Study of EMC for Cu bonding wire application
Author
Seki, Hidetoshi ; Ping, Chen ; Nakatake, Hiroshi ; Zenbutsu, Shin-ichi ; Itoh, Shingo
Author_Institution
Electron. Device Mater. Res. Lab. I, Sumitomo Bakelite Co., Ltd., Utsunomiya, Japan
fYear
2010
fDate
24-26 Aug. 2010
Firstpage
1
Lastpage
3
Abstract
The influence of EMC (Epoxy Molding Compound) and reliability with fine Cu wire was studied. It is found that the failure mode was corrosion at the intermetallic layer of the wire bonding part by failure analysis after HAST (Highly Accelerated Temperature & Humidity Stress Test). Al elution and Cl ion was observed at the intermetallic layer. EMC with lower Cl ion content and Al inhibitor of corrosion shows better HAST property. The selection of flame retardant for green EMC is important because some retardant has a negative impact on HAST performance.
Keywords
aluminium; chlorine; copper; corrosion; failure analysis; lead bonding; life testing; moulding; Al; Cl; Cu; HAST; corrosion; epoxy molding compound; failure analysis; failure mode; flame retardant selection; green EMC; highly accelerated temperature test; humidity stress test; intermetallic layer; reliability; wire bonding; Bonding; Copper; Corrosion; Electromagnetic compatibility; Gold; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
CPMT Symposium Japan, 2010 IEEE
Conference_Location
Tokyo
Print_ISBN
978-1-4244-7593-3
Type
conf
DOI
10.1109/CPMTSYMPJ.2010.5679680
Filename
5679680
Link To Document