DocumentCode :
1927822
Title :
Design and fabrication of an electromagnetic pump for microfluidic applications
Author :
Chia-Yen Lee ; Lung-Ming Fu ; Po-Cheng Chou ; Jian-Hao Zhong
Author_Institution :
Dept. of Vehicle Eng., Nat. Pingtung Univ. of Sci. & Technol., Pingtung, Taiwan
fYear :
2012
fDate :
23-26 Sept. 2012
Firstpage :
199
Lastpage :
203
Abstract :
This study presents design and fabrication of an electromagnetic pump for microfluidic applications. The pump comprises four major components, namely a lower glass plate containing a copper microcoil, a middle PMMA plate incorporating a PDMS diaphragm with a surface-mounted magnet, upper PMMA channel plates, and a ball-type check valve located at the channel inlet. When an AC current is passed through the microcoil, an alternating electromagnetic force is established between the coil and the magnet. The resulting bi-directional deflection of the PDMS diaphragm causes the check-valve to open and close; thereby creating a pumping effect. The experimental results show that a coil input current of 0.4 A generates an electromagnetic force of 4,700 dynes and a diaphragm deflection of 108 μm. Given an actuating voltage of 3 V and a driving frequency of 15 Hz, the flow rate is found to be 13.2 mL/min under zero head pressure conditions.
Keywords :
coils; copper; electromagnetic devices; electromagnetic forces; glass; microfabrication; microfluidics; plates (structures); polymers; pumps; surface mount technology; AC current; PDMS diaphragm; SiO2-Cu; actuating voltage; ball-type check valve; bidirectional deflection; channel inlet; check-valve; coil input current; current 0.4 A; electromagnetic force; electromagnetic pump design; electromagnetic pump fabrication; frequency 15 Hz; glass plate; microcoil; microfluidic applications; middle PMMA channel plate; pumping effect; surface-mounted magnet; voltage 3 V; zero head pressure conditions; PDMS diaphragm; electromagnetic pump; electroplating;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Industrial Electronics and Applications (ISIEA), 2012 IEEE Symposium on
Conference_Location :
Bandung
Print_ISBN :
978-1-4673-3004-6
Type :
conf
DOI :
10.1109/ISIEA.2012.6496628
Filename :
6496628
Link To Document :
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