Title :
A new via fence structure for crosstalk reduction in high density stripline packages
Author :
Gipprich, J. ; Stevens, D.
Author_Institution :
Electron. Sensors & Syst. Sector, Northrop Grumman Corp., Baltimore, MD, USA
Abstract :
Via fences are often placed between stripline conductors to suppress unwanted parallel plate mode coupling. However, if the striplines are too close to a fence, the coupling between the striplines is enhanced rather than reduced. In this paper we analyze the coupling between two striplines separated by a via fence using electromagnetic simulation for various dimensional parameters. Finally, we introduce a new via structure that significantly reduces the unwanted coupling.
Keywords :
crosstalk; electromagnetic coupling; equivalent circuits; integrated circuit packaging; microwave integrated circuits; strip lines; crosstalk reduction; electromagnetic simulation; high density stripline packages; parallel plate mode coupling suppression; stripline conductors; via fence structure; Conductors; Coupling circuits; Crosstalk; Electromagnetic analysis; Electromagnetic coupling; Electromagnetic waveguides; Electronics packaging; Integrated circuit packaging; Sensor systems; Stripline;
Conference_Titel :
Microwave Symposium Digest, 2001 IEEE MTT-S International
Conference_Location :
Phoenix, AZ, USA
Print_ISBN :
0-7803-6538-0
DOI :
10.1109/MWSYM.2001.967237
