DocumentCode
1928295
Title
A new via fence structure for crosstalk reduction in high density stripline packages
Author
Gipprich, J. ; Stevens, D.
Author_Institution
Electron. Sensors & Syst. Sector, Northrop Grumman Corp., Baltimore, MD, USA
Volume
3
fYear
2001
fDate
20-24 May 2001
Firstpage
1719
Abstract
Via fences are often placed between stripline conductors to suppress unwanted parallel plate mode coupling. However, if the striplines are too close to a fence, the coupling between the striplines is enhanced rather than reduced. In this paper we analyze the coupling between two striplines separated by a via fence using electromagnetic simulation for various dimensional parameters. Finally, we introduce a new via structure that significantly reduces the unwanted coupling.
Keywords
crosstalk; electromagnetic coupling; equivalent circuits; integrated circuit packaging; microwave integrated circuits; strip lines; crosstalk reduction; electromagnetic simulation; high density stripline packages; parallel plate mode coupling suppression; stripline conductors; via fence structure; Conductors; Coupling circuits; Crosstalk; Electromagnetic analysis; Electromagnetic coupling; Electromagnetic waveguides; Electronics packaging; Integrated circuit packaging; Sensor systems; Stripline;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium Digest, 2001 IEEE MTT-S International
Conference_Location
Phoenix, AZ, USA
ISSN
0149-645X
Print_ISBN
0-7803-6538-0
Type
conf
DOI
10.1109/MWSYM.2001.967237
Filename
967237
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