Silicon substrate coupling noise modeling, analysis, and experimental verification for mixed signal integrated circuit design

Author

Jin, W. ; Eo, Y. ; Shim, J.I. ; Eisenstadt, W.R. ; Park, M.Y. ; Yu, H.K.

Author_Institution

Dept. of Electr. & Comput. Eng., Hanyang Univ., Ansan, South Korea

Volume

3

fYear

2001

fDate

20-24 May 2001

Firstpage

1727

Abstract

The frequency-variant characteristics of a silicon substrate were physically modeled, analytically investigated, and experimentally verified. The scalable circuit model parameter extraction methodology was newly developed. Thus, the proposed technique can provides the efficient performance evaluations as well as the accurate design guidelines concerned with the complicated mixed signal integrated circuit designs.

Keywords

S-parameters; elemental semiconductors; integrated circuit design; integrated circuit modelling; integrated circuit noise; mixed analogue-digital integrated circuits; silicon; substrates; Si; Si substrate coupling noise; design guidelines; frequency-variant characteristics; mixed signal IC design; noise modeling; parameter extraction methodology; performance evaluations; scalable circuit model parameter extraction; Circuit noise; Circuit testing; Coupling circuits; Equivalent circuits; Frequency; Mixed analog digital integrated circuits; Parameter extraction; Signal analysis; Signal design; Silicon;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Symposium Digest, 2001 IEEE MTT-S International

Conference_Location

Phoenix, AZ, USA

ISSN

0149-645X

Print_ISBN

0-7803-6538-0

Type

conf

DOI

10.1109/MWSYM.2001.967239

Filename

967239