Title :
RF-microwave multi-layer integrated passives using fully organic System on Package (SOP) technology
Author :
Davis, M.F. ; Sutono, A. ; Lim, K. ; Laskar, J. ; Sundaram, V. ; Hobbs, J. ; White, G.E. ; Tummala, R.
Author_Institution :
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
This paper presents high-density, fully organic multi-layer interconnects and integrated passives for RF and microwave System on Package (SOP) development. The components developed in this technology include novel CPW-microstrip transitions, high Q passives, as well as a planar antenna on a package. High Q passives, designed to be implemented using the featured CPW-microstrip transitions in this organic multi-layer technology, demonstrate the feasibility of implementing SOP technology for RF and microwave applications. This technology also employs a lifted slot antenna with vertical feed to reduce loss at the feeding point and to minimize pattern distortion.
Keywords :
Q-factor; UHF integrated circuits; coplanar waveguides; inductors; integrated circuit interconnections; integrated circuit packaging; microwave integrated circuits; multichip modules; slot antennas; waveguide transitions; CPW-microstrip transitions; RF applications; fully organic SOP technology; high Q passives; high-density multilayer interconnects; lifted slot antenna; microwave applications; multilayer integrated passives; organic system on package technology; planar antenna on package; vertical feed; Antenna feeds; Costs; Dielectric substrates; Inductors; Integrated circuit interconnections; Microwave technology; Organic materials; Packaging; Radio frequency; Slot antennas;
Conference_Titel :
Microwave Symposium Digest, 2001 IEEE MTT-S International
Conference_Location :
Phoenix, AZ, USA
Print_ISBN :
0-7803-6538-0
DOI :
10.1109/MWSYM.2001.967240
