Title :
Microstrip line on ground plane with closely spaced perforations-simple CAD formulas by synthetic asymptote
Author :
Chow, Y.L. ; Wan, K.L. ; Sarkar, T.K. ; Kolundzija, B.
Author_Institution :
City Univ. of Hong Kong, China
Abstract :
Simple CAD formulas, of a microstrip line on a ground plane with periodic perforations, closely spaced and at low frequency, are derived for possible application in the multi-layer circuits in an LTCC package. The derivation is done by the novel technique of synthetic asymptote. Compared with the hardware experiment, the average error of the CAD formulas can be as low as 2.5%. The formulas have no arbitrary constants and give good physical insights.
Keywords :
ceramic packaging; circuit CAD; microstrip circuits; microstrip lines; microwave circuits; CAD formulas; LTCC package; average error; closely spaced perforations; ground plane; microstrip line; multi-layer circuits; synthetic asymptote; Capacitance; Circuits; Frequency; Hardware; Impedance; Inductance; Land surface temperature; Microstrip; Packaging; Propagation constant;
Conference_Titel :
Microwave Symposium Digest, 2001 IEEE MTT-S International
Conference_Location :
Phoenix, AZ, USA
Print_ISBN :
0-7803-6538-0
DOI :
10.1109/MWSYM.2001.967246
