Abstract :
This paper presents new developments and perspectives in phased arrays radars and electronic warfare for the next generations of T/R modules (medium/long term), in order to decrease the mass production cost, while increasing the level of performance and reliability. In terms of physical architecture, even if the brick one is more current at mid-term, the tile concept is investigated for conformal and/or multifunction phased array antennas : a 3-dimension module will lead to a drastic reduction of size and weight of the antenna. MMICs are always the key components, with evolutions towards multifunction chips, new processes like GaN,SiGe, MEMS power switches. Concerning the packaging, a technological roadmap indicates the different capabilities : thick film multilayer ceramic circuits, co-fired ceramics based on LTCC or HTCC processes, surface-mounted packages on printed circuits boards and 3D architectures. The interconnection domain is also now more and more important in order to be compatible with the level of integration required for the microwave modules : fuzz buttons, flex, sub-miniature connectors. All these technologies mastered by Thales are dual for airborne and space, military and civilian applications.
Keywords :
MMIC; antenna phased arrays; ceramic packaging; electronic warfare; integrated circuit interconnections; military radar; phased array radar; printed circuits; surface mount technology; thick film circuits; GaN; HTCC process; LTCC process; MEMS power switch; MMIC; SiGe; T/R module; Thales component; co-fired ceramics; electronic warfare; interconnection domain; microwave module; multifunction chip; multifunction phased array antenna; phased array radar; printed circuits board; surface-mounted package; thick film multilayer ceramic circuit; Antenna arrays; Ceramics; Costs; Electronic warfare; Mass production; Packaging; Phased arrays; Radar; Space technology; Tiles;
