Title :
LTCC as MCM substrate: design of strip-line structures and flip-chip interconnects
Author :
Schmuckle, F.J. ; Jentzsch, A. ; Heinrich, W. ; Butz, J. ; Spinnler, M.
Author_Institution :
Ferdinand-Braun-Inst., Berlin, Germany
Abstract :
LTCC multilayer substrates offer a cost-effective MCM solution for frequencies around 20 GHz and beyond. This paper reports on LTCC-specific transmission-line structures using a commercially available process. For the chip interconnect, a flip-chip approach contacting the backside is chosen, which, in a first step, is realized on conventional ceramics.
Keywords :
ceramic packaging; flip-chip devices; integrated circuit interconnections; multichip modules; strip lines; 20 GHz; LTCC; MCM substrate; backside; chip interconnect; flip-chip interconnects; multilayer substrates; strip-line structures; Ceramics; Frequency; Impedance; Microstrip; Nonhomogeneous media; Strips; Surface treatment; Temperature; Transmission lines; Wiring;
Conference_Titel :
Microwave Symposium Digest, 2001 IEEE MTT-S International
Conference_Location :
Phoenix, AZ, USA
Print_ISBN :
0-7803-6538-0
DOI :
10.1109/MWSYM.2001.967280
