• DocumentCode
    1929471
  • Title

    Comparative evaluation of SiC devices for PWM buck rectifier based active front end converter for MV grid interface

  • Author

    Madhusoodhanan, S. ; Yonghwan Cho ; Kadavelugu, Arun ; Bhattacharya, Surya ; Grider, David ; Sei-Hyung Ryu ; Agarwal, Abhishek ; Leslie, Scott

  • Author_Institution
    Dept. of ECE, North Carolina State Univ., Raleigh, NC, USA
  • fYear
    2013
  • fDate
    15-19 Sept. 2013
  • Firstpage
    3034
  • Lastpage
    3041
  • Abstract
    In this paper a new method for implementation of a 3-phase medium voltage rectifier is presented for Active Front End grid interface applications. A current source based PWM buck rectifier with Silicon Carbide (SiC) devices, different from the traditional GTO based current source rectifier, is used to grid tie with 3-phase, 4.16 kV grid. The power level considered is 100 kVA. Simplicity of construction, very high efficiency, better input line current control and small volume are the main advantages of this system. Due to low switching losses compared with traditional GTOs, PWM operation of the rectifier at higher switching frequencies is possible. A detailed simulation shows the validity of the proposed method. Efficiency comparison of the PWM Buck rectifier with 10 kV/10 A SiC MOSFET and 15 kV/20 A SiC IGBT as the active devices is also presented. Low voltage hardware prototype based high frequency switching validation is also carried out.
  • Keywords
    PWM power convertors; PWM rectifiers; electric current control; silicon compounds; 3-phase medium voltage rectifier; IGBT; MV grid interface; PWM buck rectifier; SiC; active front end converter; current 10 A; current 20 A; current control; silicon carbide devices; voltage 10 kV; voltage 15 kV; voltage 4.16 kV; Capacitors; Pulse width modulation; Rectifiers; Silicon carbide; Switches; Switching frequency; Voltage control;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Energy Conversion Congress and Exposition (ECCE), 2013 IEEE
  • Conference_Location
    Denver, CO
  • Type

    conf

  • DOI
    10.1109/ECCE.2013.6647097
  • Filename
    6647097