Coupled TLM-thermal analysis in the time domain

Author

Wei Liu ; So, P.P.M. ; Hoefer, W.J.R.

Author_Institution

Dept. of Electr. & Comput. Eng., Victoria Univ., BC, Canada

Volume

3

fYear

2001

fDate

20-24 May 2001

Firstpage

2043

Abstract

A coupled time domain TLM-thermal analysis technique is presented in this paper. It is a hybrid combination of algorithms comprising TLM, FDTD and ray optical algorithms for evaluating the transient thermal behavior of objects placed inside a cavity or waveguide. Electromagnetic fields are calculated using a GSCN 3D TLM algorithm. We have developed the analysis procedure primarily for evaluating power handling capability of waveguide and microstrip structures. Nevertheless, this procedure can be applied to general microwave heating problems.

Keywords

electromagnetic fields; microwave heating; ray tracing; thermal analysis; time-domain analysis; transmission line matrix methods; GSCN 3D TLM algorithm; analysis procedure; coupled TLM-thermal analysis; electromagnetic fields; microwave heating problems; power handling capability; ray optical algorithms; time domain; transient thermal behavior; Conductors; Electromagnetic heating; Electromagnetic waveguides; Finite difference methods; Heat transfer; Microwave ovens; Optical surface waves; Optical waveguides; Surface waves; Time domain analysis;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Symposium Digest, 2001 IEEE MTT-S International

Conference_Location

Phoenix, AZ, USA

ISSN

0149-645X

Print_ISBN

0-7803-6538-0

Type

conf

DOI

10.1109/MWSYM.2001.967313

Filename

967313