Lumped and distributed device embedding techniques in time domain TLM field models

There exist several techniques for embedding devices into TLM networks. These techniques yield in general slightly different results when the mesh size is finite. In this paper, we classify these techniques, compare results obtained with different embedding methods, and show how SPICE models of active and passive lumped element circuits can be incorporated into 2D and 3D TLM networks. Recommendations as to the best method for a given device type will be formulated.