DocumentCode :
1930367
Title :
Laser ablation inside transparent thin films
Author :
Kumar, Kush ; Lee, Kenneth K. C. ; Li, Jie ; Nogami, J. ; Herman, Peter R. ; Kherani, Nazir P.
Author_Institution :
Dept. of Mater. Sci. & Eng., Univ. of Toronto, Toronto, ON, Canada
fYear :
2013
fDate :
12-16 May 2013
Firstpage :
1
Lastpage :
1
Abstract :
The laser interactions and processing of thin films is a rapidly growing area of research that serves broadly in microelectronic, display, photovoltaic, sensing and biological applications. Traditional concepts of laser marking, machining and scribing in opaque materials have been widely extended into transparent substrates or films to enable new approaches in printing or manufacturing by laser induced forward transfer (LIFT) [1] and other novel directions for catapulting single cells [2] and forming blisters [3] or microfluidic structures [4]. These approaches typically rely on inducing strong laser-plasma interactions internally at the interface of two media. In contrast, nonlinear optical interactions can be more flexibly positioned within the focal volume of short-pulsed lasers to drive new approaches for welding, writing optical circuits, or shaping three-dimensional opto-fluidic circuits inside transparent materials.
Keywords :
high-speed optical techniques; laser ablation; nanofabrication; nanostructured materials; silicon compounds; thin films; Gaussian profiles; SiNx; SiOx; femtosecond fiber laser; frequency 100 kHz; interface machining; internal machining; laser ablation; nanostructured materials; surface machining; time 170 fs; transparent thin films; Etching; Films; Lasers; Machining; Silicon; Ultrafast optics;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Lasers and Electro-Optics Europe (CLEO EUROPE/IQEC), 2013 Conference on and International Quantum Electronics Conference
Conference_Location :
Munich
Print_ISBN :
978-1-4799-0593-5
Type :
conf
DOI :
10.1109/CLEOE-IQEC.2013.6801557
Filename :
6801557
Link To Document :
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