Title :
The Ideal Solderable Copper Protective Silver Coatlng For PCB
Author :
Enomoto, Takao ; Tsunoda, Mutsuharu
Keywords :
Assembly; Bonding; Coatings; Copper; Lead; Printed circuits; Protection; Silver; Surface topography; Surface treatment;
Conference_Titel :
IEMT/IMC Symposium, 1997., 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]
Conference_Location :
IEEE
Print_ISBN :
0-7803-4235-6
