DocumentCode
1931224
Title
A well concept for field implant free isolation and width independent n-MOSFET threshold and reliability
Author
Zeller, Ch. ; Mazure, C. ; Lill, A. ; Kerber, M.
Author_Institution
Siemens AG, Corporate Research and Development, Otto-Hahn-Ring 6, D-8000 Mÿnchen 83, F.R.G.
fYear
1990
fDate
10-13 Sept. 1990
Firstpage
523
Lastpage
526
Abstract
Boron segregation effects in the p-well during field oxidation can be compensated by splitting the well drive-in into two parts before and after field oxidation. In consequence sufficient field isolation can be achieved without channel stop implants even for moderate well implantation doses, keeping parasitic junction capacitances and body factors low. The smaller doping gradient between field and active areas leads to nearly neutral transistor-width dependence and width independent n-channel degradation.
Keywords
Boron; CMOS process; CMOS technology; Degradation; Doping; Implants; MOSFET circuits; Oxidation; Parasitic capacitance; Threshold voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid State Device Research Conference, 1990. ESSDERC '90. 20th European
Conference_Location
Nottingham, England
Print_ISBN
0750300655
Type
conf
Filename
5436302
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