DocumentCode :
1931224
Title :
A well concept for field implant free isolation and width independent n-MOSFET threshold and reliability
Author :
Zeller, Ch. ; Mazure, C. ; Lill, A. ; Kerber, M.
Author_Institution :
Siemens AG, Corporate Research and Development, Otto-Hahn-Ring 6, D-8000 Mÿnchen 83, F.R.G.
fYear :
1990
fDate :
10-13 Sept. 1990
Firstpage :
523
Lastpage :
526
Abstract :
Boron segregation effects in the p-well during field oxidation can be compensated by splitting the well drive-in into two parts before and after field oxidation. In consequence sufficient field isolation can be achieved without channel stop implants even for moderate well implantation doses, keeping parasitic junction capacitances and body factors low. The smaller doping gradient between field and active areas leads to nearly neutral transistor-width dependence and width independent n-channel degradation.
Keywords :
Boron; CMOS process; CMOS technology; Degradation; Doping; Implants; MOSFET circuits; Oxidation; Parasitic capacitance; Threshold voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid State Device Research Conference, 1990. ESSDERC '90. 20th European
Conference_Location :
Nottingham, England
Print_ISBN :
0750300655
Type :
conf
Filename :
5436302
Link To Document :
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