• DocumentCode
    1931224
  • Title

    A well concept for field implant free isolation and width independent n-MOSFET threshold and reliability

  • Author

    Zeller, Ch. ; Mazure, C. ; Lill, A. ; Kerber, M.

  • Author_Institution
    Siemens AG, Corporate Research and Development, Otto-Hahn-Ring 6, D-8000 Mÿnchen 83, F.R.G.
  • fYear
    1990
  • fDate
    10-13 Sept. 1990
  • Firstpage
    523
  • Lastpage
    526
  • Abstract
    Boron segregation effects in the p-well during field oxidation can be compensated by splitting the well drive-in into two parts before and after field oxidation. In consequence sufficient field isolation can be achieved without channel stop implants even for moderate well implantation doses, keeping parasitic junction capacitances and body factors low. The smaller doping gradient between field and active areas leads to nearly neutral transistor-width dependence and width independent n-channel degradation.
  • Keywords
    Boron; CMOS process; CMOS technology; Degradation; Doping; Implants; MOSFET circuits; Oxidation; Parasitic capacitance; Threshold voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid State Device Research Conference, 1990. ESSDERC '90. 20th European
  • Conference_Location
    Nottingham, England
  • Print_ISBN
    0750300655
  • Type

    conf

  • Filename
    5436302