Title :
Evaluation of surface microroughness for surface activated bonding
Author :
Tsukamoto, Kei ; Higurashi, Eiji ; Suga, Tadatomo
Author_Institution :
Dept. of Precision Eng., Univ. of Tokyo, Tokyo, Japan
Abstract :
In Surface Activated Bonding (SAB), high surface flatness is required for the stability of bonding. Though RMS (Root Mean Square) is often used for the evaluation of surface roughness, RMS is not always enough to express surface roughness appropriately. Therefore, we introduced a numerical method called as Power Spectral Density function to the surfaces of bonding targets. In this research silicon, gold and copper samples are evaluated.
Keywords :
density functional theory; integrated circuit packaging; stability; surface roughness; high surface flatness; power spectral density function; root mean square; stability; surface activated bonding; surface microroughness; Optical surface waves; Radiation effects; Rough surfaces; Silicon; Surface roughness; Surface treatment; Surface waves;
Conference_Titel :
CPMT Symposium Japan, 2010 IEEE
Conference_Location :
Tokyo
Print_ISBN :
978-1-4244-7593-3
DOI :
10.1109/CPMTSYMPJ.2010.5679979
