• DocumentCode
    1931865
  • Title

    A transient core loss calculation algorithm for soft magnetic composite material

  • Author

    Wasekura, Masaki ; Chi-Ming Wang ; Maeda, Yuji ; Lorenz, Robert D.

  • Author_Institution
    Toyota Motor Corp., Toyota, Japan
  • fYear
    2013
  • fDate
    15-19 Sept. 2013
  • Firstpage
    3719
  • Lastpage
    3725
  • Abstract
    In order to investigate the feasibility of dynamic loss minimization for DC-to-DC converters by control methods, transient core loss analysis for soft magnetic composite material is presented in this paper. A practical calculation model based on equivalent elliptical loop (EEL) model is developed to obtain the transient losses, and the algorithm is modified to adapt to non-sinusoidal waveforms by checking inflection points of the magnetic flux trajectory. With this model, time domain information of trajectories can be calculated automatically. And because of the simplicity of this model, it is easy to apply the calculation to finite element analysis. In experiments, a 200 Hz sinusoidal wave and also the 200 Hz wave combined with a single odd harmonic (3rd, 5th, ...49th) are applied to a ring core made of one-percent SiFe alloy powder and used to evaluate and document accuracy.
  • Keywords
    DC-DC power convertors; composite materials; cores; finite element analysis; soft magnetic materials; time-domain analysis; transient analysis; DC-to-DC converters; EEL model; dynamic loss minimization; equivalent elliptical loop model; finite element analysis; frequency 200 Hz; inflection points; magnetic flux trajectory; nonsinusoidal waveforms; one-percent SiFe alloy powder; single odd harmonic; sinusoidal wave; soft magnetic composite material; time domain information; transient core loss calculation algorithm; Adaptation models; Core loss; Eddy currents; Magnetic cores; Magnetic hysteresis; Trajectory; Transient analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Energy Conversion Congress and Exposition (ECCE), 2013 IEEE
  • Conference_Location
    Denver, CO
  • Type

    conf

  • DOI
    10.1109/ECCE.2013.6647192
  • Filename
    6647192