مرکز منطقه ای اطلاع رساني علوم و فناوري - Development Of A Tapeless Lead-on-chip (loc) Package With I-line Photosensitive Thermosetting Polyamides

DocumentCode :

1932083

Title :

Development Of A Tapeless Lead-on-chip (loc) Package With I-line Photosensitive Thermosetting Polyamides

Author :

Amagai, Masazumi

fYear :

1997

fDate :

16-18 April 1997

Firstpage :

280

Lastpage :

285

Keywords :

Costs; Delamination; Lab-on-a-chip; Lead; Packaging; Passivation; Polyimides; Production; Stress; Ultra large scale integration;

fLanguage :

English

Publisher :

ieee

Conference_Titel :

IEMT/IMC Symposium, 1997., 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]

Conference_Location :

IEEE

Print_ISBN :

0-7803-4235-6

Type :

conf

Filename :

619021

Link To Document :