DocumentCode :
1932083
Title :
Development Of A Tapeless Lead-on-chip (loc) Package With I-line Photosensitive Thermosetting Polyamides
Author :
Amagai, Masazumi
fYear :
1997
fDate :
16-18 April 1997
Firstpage :
280
Lastpage :
285
Keywords :
Costs; Delamination; Lab-on-a-chip; Lead; Packaging; Passivation; Polyimides; Production; Stress; Ultra large scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
IEMT/IMC Symposium, 1997., 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]
Conference_Location :
IEEE
Print_ISBN :
0-7803-4235-6
Type :
conf
Filename :
619021
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=1932083