Development Of A Tapeless Lead-on-chip (loc) Package With I-line Photosensitive Thermosetting Polyamides

Author

Amagai, Masazumi

fYear

1997

fDate

16-18 April 1997

Firstpage

280

Lastpage

285

Keywords

Costs; Delamination; Lab-on-a-chip; Lead; Packaging; Passivation; Polyimides; Production; Stress; Ultra large scale integration;

fLanguage

English

Publisher

ieee

Conference_Titel

IEMT/IMC Symposium, 1997., 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]

Conference_Location

IEEE

Print_ISBN

0-7803-4235-6

Type

Filename

619021

Link To Document