High packing density techniques for cost effective multifunction GaAs MMICs

Gallium Arsenide MMIC technology must now be considered mature with many proven circuit designs. However, the majority of these are ``conventional´´ designs realised on the GaAs medium and as such do not take maximum advantage of the process. By utilising a sophisticated modern MMIC process considerable size, and hence cost, reductions can be achieved by using advanced high packing density techniques. These have led to the first cost effective ``systems on a chip´´.