DocumentCode :
1932819
Title :
High Density Bga Substrates Fabricated By Laser Technologies
Author :
Hirakawa, Tadashi ; Sato, Fumitaka
fYear :
1997
fDate :
16-18 April 1997
Firstpage :
295
Lastpage :
298
Keywords :
Bonding; Chip scale packaging; Laminates; Machinery; Optical arrays; Optical pulse shaping; Packaging machines; Plastic packaging; Polyimides; Substrates;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
IEMT/IMC Symposium, 1997., 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]
Conference_Location :
IEEE
Print_ISBN :
0-7803-4235-6
Type :
conf
Filename :
619024
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=1932819
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