Etching processes of Si<111> wafers for fabrication of microphotonic components

Author

Cristea, D. ; Purica, M. ; Manea, E. ; Obreja, P.

Author_Institution

Nat. Inst. for R&D in Microtechnologies, Bucharest, Romania

Volume

1

fYear

2001

fDate

2001

Firstpage

197

Abstract

This paper presents the experiments we have performed to obtain microphotonic components by anisotropic wet etching of Si<111>-oriented wafers. We studied influence of the mask orientation and lay-out, and of the technological parameters (temperature, concentration of the etching solution) on the shape and size of the etched cavity. We experimented fabrication of freestanding structures made by SiO₂ and c-Si that can be used as movable micromirrors; and waveguides

Keywords

etching; micro-optics; mirrors; optical fabrication; optical waveguides; silicon; Si; Si<111> wafers; SiO₂; anisotropic wet etching; concentration; etched cavity shape; etched cavity size; etching processes; etching solution; freestanding structures; lay-out; mask orientation; microphotonic components fabrication; movable micromirrors; optical waveguides; technological parameters; temperature; Anisotropic magnetoresistance; Bridges; Chemical processes; Micromirrors; Optical device fabrication; Oxidation; Plasma applications; Plasma temperature; Silicon; Wet etching;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Conference, 2001. CAS 2001 Proceedings. International

Conference_Location

Sinaia

Print_ISBN

0-7803-6666-2

Type

conf

DOI

10.1109/SMICND.2001.967445

Filename

967445