DocumentCode
1933087
Title
Fine Pitch High Pin Count AIN LGga Package
Author
Asai, Hironori ; Kudo, Juri-ichi ; Yano, Kci-ichi ; Yasumoto, Taka-aki ; Kimura, Kazuo ; Iyogi, K. ; Moruna, J. ; Yamaguchi, Hitoshi ; Iwasc, Nobuo
fYear
1997
fDate
16-18 April 1997
Firstpage
299
Lastpage
302
Keywords
Area measurement; Capacitors; Costs; Flip chip; Inorganic materials; Lapping; Packaging; Semiconductor device measurement; Shape measurement; Sockets;
fLanguage
English
Publisher
ieee
Conference_Titel
IEMT/IMC Symposium, 1997., 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]
Conference_Location
IEEE
Print_ISBN
0-7803-4235-6
Type
conf
Filename
619025
Link To Document