Title :
Insulation Reliability Of Fine Pitch Copper Paste Filled Via Holes
Author :
Kawahara, Takeo ; Okamoto, Tomomi ; Furugori, Yuko
Keywords :
Circuit testing; Copper; Dielectrics; Humidity; Insulation testing; Powders; Printed circuits; Printing; Silver; Temperature;
Conference_Titel :
IEMT/IMC Symposium, 1997., 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]
Conference_Location :
IEEE
Print_ISBN :
0-7803-4235-6
