DocumentCode :
1933885
Title :
4H-SiC bipolar power diodes realized by ion implantation
Author :
Lazar, M. ; Planson, D. ; Isoird, K. ; Locatelli, M.L. ; Raynaud, C. ; Chante, J.P.
Author_Institution :
INSA, CNRS, Villeurbanne, France
Volume :
2
fYear :
2001
fDate :
37165
Firstpage :
349
Abstract :
Physico-chemical and electrical investigations were carried out in 4H-SiC p-type layers created by aluminum ion implantation at room temperature and high temperature post-implantation annealing. Crystal recovery and dopant preservation after annealing are proved by RBS/C and SIMS measurements. Dopant activation is evaluate by sheet resistance measurements. These results were applied for high voltage bipolar diodes with JTE protection
Keywords :
Rutherford backscattering; aluminium; ion implantation; power semiconductor diodes; recrystallisation annealing; secondary ion mass spectra; silicon compounds; wide band gap semiconductors; 4H-SiC:Al bipolar power diodes; JTE protection; RBS/C; SIMS; SiC:Al; crystal recovery; dopant activation; dopant preservation; high temperature post-implantation annealing; high voltage bipolar diodes; ion implantation; junction termination extension; recrystallization; sheet resistance; Aluminum; Annealing; Diodes; Electrical resistance measurement; Furnaces; Heating; Ion implantation; Silicon carbide; Temperature; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Conference, 2001. CAS 2001 Proceedings. International
Conference_Location :
Sinaia
Print_ISBN :
0-7803-6666-2
Type :
conf
DOI :
10.1109/SMICND.2001.967481
Filename :
967481
Link To Document :
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