Thermal issues in microelectronics

fYear

2009

fDate

25-27 June 2009

Firstpage

345

Lastpage

346

Abstract

Start of the above-titled section of the conference proceedings record.

fLanguage

English

Publisher

ieee

Conference_Titel

Mixed Design of Integrated Circuits & Systems, 2009. MIXDES '09. MIXDES-16th International Conference

Conference_Location

Lodz

Print_ISBN

978-1-4244-4798-5

Type

conf

Filename

5289533

Link To Document