Title :
Testing Flip Chip Reliability By The Four Probe Method In Bypass Diode Connected Chain
Author :
Tuominen, Aulis ; Perttula, Altti
Keywords :
Condition monitoring; Diodes; Electrical resistance measurement; Flip chip; Packaging machines; Probes; Temperature; Testing; Voltage; Wires;
Conference_Titel :
IEMT/IMC Symposium, 1997., 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]
Conference_Location :
IEEE
Print_ISBN :
0-7803-4235-6
