DocumentCode

1934441

Title

Testing Flip Chip Reliability By The Four Probe Method In Bypass Diode Connected Chain

Author

Tuominen, Aulis ; Perttula, Altti

fYear

1997

fDate

16-18 April 1997

Firstpage

321

Lastpage

325

Keywords

Condition monitoring; Diodes; Electrical resistance measurement; Flip chip; Packaging machines; Probes; Temperature; Testing; Voltage; Wires;

fLanguage

English

Publisher

ieee

Conference_Titel

IEMT/IMC Symposium, 1997., 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]

Conference_Location

IEEE

Print_ISBN

0-7803-4235-6

Type

conf

Filename

619030