[Front and back covers]

The following topics are dealt with: CMOS technology; 3D current flow; FinFET compact modelling; silicon-on-insulator MOSFET; piezoelectric elements; digital vector modulator; distributed radiation monitoring system; high power amplifier chain nonlinearity; multipurpose RF field vector controller; high-throughput embedded devices; bluetooth based multidomain chat application; image signal processing; smartphones; silicon carbide technology; 1/f noise reduction; frequency DeltaSigma modulator; low-pass filter; Kohonen neural networks; automotive radio applications; electronic circuits CAD systems; low-power integrated image sensor; analog multiplier; asynchronous 4-bit flash analog-to-digital CMOS converter; compositional microprogram control unit; thermal assisted switching magnetic tunnel junctions; FPGA memory elements; digital filter implementation; NMOS current mirror thermal analysis; pulse thermography measurements; heat dissipation; electrothermal filters; hydrogen bonding network; wide-band on-chip spiral inductor model; contact resistance; stainless steel electroconductive yarns; VLSI interconnects; humidity sensor; analog systems diagnostics; microelectronic technology; mixed-signal testing; crosstalk-type dynamic faults; power electronics; digitally programmable polyphase filter; monolithic active pixel sensors; stochastic optimisation; ECG signal processing; fluorescent dye cell images; stroke hospitalisation; coldfire CPU arithmetic logical unit; piezoelectric vibration energy harvester output power level; wireless sensor node; rotary machine diagnostic system; and photovoltaics.