DocumentCode
1934777
Title
A simulation about the influence of the gate-source-drain distance on the AlGaN/GaN HEMT performance at Ka-band
Author
Dechun, Guo ; Kankan, Qi ; Junfeng, Cui ; Xiaobin, Luo ; Chao, Yue
Author_Institution
Beijing Inst. of Technol., Beijing, China
fYear
2012
fDate
18-20 Sept. 2012
Firstpage
1
Lastpage
4
Abstract
To improve the frequency and the output power, we present the results on the effect of distance between source-gate-drain in AlGaN/GaN high electron mobility transistors (HEMTs) by silvaco emulator. First, we adopt centrosymmetric gate structure, it means the Lgs(source-gate spacing) is equal to the Lgd(gate-drain spacing), and the Lsd(source-drain spacing)changes from 4μm to 2.4 um. It presents that the drain current, transconductance, the gain at 35GHz, fT(current gain cutoff frequency)and fmax(maximum frequency of oscillation)get improved with the decrease of Lsd. However, when the distance comes to a certain extent, the fringe scatter from ohmic contact of source and drain would weaken electron mobility in channel layer, and it is hard to improve in technology fabrication. In addition, changing the Lsg and Ldg simultaneously demonstrates the influence of the different gate locations. Finally, we get the range of source-gate-drain distance for Ka-band AlGaN/GaN HEMT by the simulation results.
Keywords
III-V semiconductors; aluminium compounds; gallium compounds; high electron mobility transistors; millimetre wave transistors; wide band gap semiconductors; AlGaN-GaN; HEMT performance; Ka-band; centrosymmetric gate structure; channel layer; current gain cutoff frequency; drain ohmic contact; frequency 35 GHz; gate-source-drain distance; high electron mobility transistors; silvaco emulator; source ohmic contact; Aluminum gallium nitride; Electron mobility; Gallium nitride; HEMTs; Logic gates; Ohmic contacts; Resistance; GaN HEMT; Gate -Drain spacing; Ka-band; Source-Gate spacing;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Workshop Series on Millimeter Wave Wireless Technology and Applications (IMWS), 2012 IEEE MTT-S International
Conference_Location
Nanjing
Print_ISBN
978-1-4673-0901-1
Electronic_ISBN
978-1-4673-0903-5
Type
conf
DOI
10.1109/IMWS2.2012.6338225
Filename
6338225
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