Title :
C4 Connection Capability Effected By Moisture In Plating Film On C4 Pad
Author :
Nakasu, Koichi ; Osakada, Akiyoshi ; Nakano, Sumio
Keywords :
Assembly; Atherosclerosis; Ceramics; Electronics packaging; Gold; Heat treatment; Integrated circuit packaging; Moisture; Substrates; Testing;
Conference_Titel :
IEMT/IMC Symposium, 1997., 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]
Conference_Location :
IEEE
Print_ISBN :
0-7803-4235-6
