Title :
Substrate integrated waveguide (SIW) technology: New research trends for low-cost and eco-friendly wireless systems
Author_Institution :
Dept. Electron., Univ. of Pavia, Pavia, Italy
Abstract :
Summary form only given. Substrate integrated waveguide (SIW) technology represents an emerging approach for the implementation of compact, low-loss and cost effective components, circuits, antennas and complete systems at microwave and millimeter-wave frequency. The interest in SIW technology is booming in the last few years, as shown by the exponentially increasing number of scientific publications, special sessions and workshops at international conferences, and by the number of industries interested in SIW applications. It appears that SIW technology is bound to become the paradigm for the implementation of cost-effective millimeter-wave systems in the next decades. This talk will present state-of-the-art results of SIW components and antennas, advanced modeling techniques, current research trends of SIW systems for future wireless sensor networks, and implementation of innovative SIW structures based on low-cost and eco-friendly materials and technologies (including paper, plastic and textile).
Keywords :
substrate integrated waveguides; wireless sensor networks; SIW components; advanced modeling techniques; cost effective components; cost-effective millimeter-wave systems; eco-friendly materials; eco-friendly wireless systems; international conferences; low-cost materials; low-cost wireless systems; low-loss components; microwave frequency; millimeter-wave frequency; substrate integrated waveguide technology; wireless sensor networks; Antenna accessories; Educational institutions; Market research; Microwave antennas; Millimeter wave technology; Substrates; Wireless communication;
Conference_Titel :
Microwave Workshop Series on Millimeter Wave Wireless Technology and Applications (IMWS), 2012 IEEE MTT-S International
Conference_Location :
Nanjing
Print_ISBN :
978-1-4673-0901-1
Electronic_ISBN :
978-1-4673-0903-5
DOI :
10.1109/IMWS2.2012.6338240