DocumentCode :
1935231
Title :
The Novel Type Of Conductive Paste Using Functionally Gradient Ag-cu Powder
Author :
Hori, T. ; Otani, A. ; Ogura, Y. ; Naliamura, M. ; Matsuda, H. ; Sato, J.
fYear :
1997
fDate :
16-18 April 1997
Firstpage :
337
Lastpage :
341
Keywords :
Circuit testing; Conductivity; Copper; Oxidation; Polymer films; Powders; Printed circuits; Printing; Surface resistance; Thick films;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
IEMT/IMC Symposium, 1997., 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]
Conference_Location :
IEEE
Print_ISBN :
0-7803-4235-6
Type :
conf
Filename :
619033
Link To Document :
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