• DocumentCode
    1935488
  • Title

    Improvement Of Solder Joint Reliabilty Between Multilayer Ceramic Package And Printed Wiring Board

  • Author

    Yamaguchi, Kouichi ; Hlgashi, M. ; Hamada, Noriaki ; Yornekura, H. ; Oike, Satoshi. ; Kunimatsu, Yasuyoshi

  • fYear
    1997
  • fDate
    16-18 April 1997
  • Firstpage
    342
  • Lastpage
    347
  • Keywords
    Ceramics; Electronics packaging; Fatigue; Nonhomogeneous media; Product design; Pulse width modulation; Soldering; Stress; Thermal expansion; Wiring;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    IEMT/IMC Symposium, 1997., 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]
  • Conference_Location
    IEEE
  • Print_ISBN
    0-7803-4235-6
  • Type

    conf

  • Filename
    619034
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1935488