Title :
Improvement Of Solder Joint Reliabilty Between Multilayer Ceramic Package And Printed Wiring Board
Author :
Yamaguchi, Kouichi ; Hlgashi, M. ; Hamada, Noriaki ; Yornekura, H. ; Oike, Satoshi. ; Kunimatsu, Yasuyoshi
Keywords :
Ceramics; Electronics packaging; Fatigue; Nonhomogeneous media; Product design; Pulse width modulation; Soldering; Stress; Thermal expansion; Wiring;
Conference_Titel :
IEMT/IMC Symposium, 1997., 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]
Conference_Location :
IEEE
Print_ISBN :
0-7803-4235-6
