• DocumentCode
    1936019
  • Title

    In-situ ESR observation of dangling bond formation during very thin amorphous SiO2 growth on Si

  • Author

    Futako, W. ; Nishizawa, M. ; Yasuda, T. ; Isoya, J. ; Yamasaki, S.

  • Author_Institution
    Angstrom Technol. Partenership, Joint Res. Center for Atom Technol., Tsukuba, Japan
  • fYear
    2001
  • fDate
    1-2 Nov. 2001
  • Firstpage
    130
  • Lastpage
    131
  • Abstract
    The processes of formation of the interface dangling bond (P/sub b/ centers) during amorphous SiO/sub 2/ thin-film growth, by oxidation, on a clean Si[111] substrate was performed. Within 0.4 nm of the oxide layer, the number of P/sub b/ centers rapidly reached the same order of magnitude as that in thick a-SiO/sub 2/ films. These results indicate that the interface defects between Si and a-SiO/sub 2/ originate mainly from the short-range chemical bonding configurations, not from the long-range accumulation of structural misfits between the two materials.
  • Keywords
    dangling bonds; dielectric thin films; elemental semiconductors; interface structure; oxidation; paramagnetic resonance; silicon; silicon compounds; 0.4 nm; Si; Si-SiO/sub 2/; amorphous SiO/sub 2/ thin-film growth; dangling bond formation; in-situ ESR observation; interface dangling bond; interface defects; oxidation; short-range chemical bonding configurations; Amorphous materials; Atomic layer deposition; Bonding; Oxidation; Paramagnetic resonance; Silicon; Spectroscopy; Surface cleaning; Temperature; Vacuum systems;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Gate Insulator, 2001. IWGI 2001. Extended Abstracts of International Workshop on
  • Conference_Location
    Tokyo, Japan
  • Print_ISBN
    4-89114-021-6
  • Type

    conf

  • DOI
    10.1109/IWGI.2001.967563
  • Filename
    967563