Title :
Photosensitive Conductive Paste
Author :
Masaki, Takaki ; Yoshimura, Akiko ; Iwanaga, Keiji ; Tanaka, Go
Keywords :
Adhesives; Ceramics; Conducting materials; Conductivity; Copper; Glass; Lithography; Packaging machines; Substrates; Tungsten;
Conference_Titel :
IEMT/IMC Symposium, 1997., 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]
Conference_Location :
IEEE
Print_ISBN :
0-7803-4235-6