• DocumentCode
    1936351
  • Title

    ArF resist CD shrinkage induced by defect inspection

  • Author

    Kuo, Tung-Chang

  • Author_Institution
    United Microelectronics Corporation, No 3, Li-Hsin Rd II, Hsinchu Science Park, Taiwan
  • fYear
    2012
  • fDate
    4-4 Sept. 2012
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    Start writing your paper here. This is a two column format. EXACTLY one page is for text and EXACTLY one page is for graphics. You need not fill the pages. The second page is reserved for graphs, figures, photographs, etc. Only two pages will be shared with the evaluators.
  • Keywords
    Collaboration; Facsimile; Inspection; Microelectronics; Production; Resists; Writing; ADI; CD shrinkage; UV light; contraction; defect inspection; yield drop;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    e-Manufacturing & Design Collaboration Symposium (eMDC), 2012
  • Conference_Location
    HsinChu, Taiwan
  • Print_ISBN
    978-1-4673-4540-8
  • Type

    conf

  • DOI
    10.1109/eMDC.2012.6338430
  • Filename
    6338430
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1936351