Title :
Dark field inspection technique on poly-silicon CMP process
Author :
Chuang, Yen ; Hung, Che-Lung ; Luoh, Tuung ; Yang, Ling-Wu ; Yang, Tahone ; Chen, Kuang-Chou ; Lu, Chih-Yuan
Author_Institution :
Technol. Dev. Center, Macronix Int. Co., Ltd., Hsinchu, Taiwan
Abstract :
Advanced high performance dark field (DF) inspection is usually utilized at larger defects and the excursions in etch, chemical mechanical polish (CMP) or film deposition processes inspection at high production throughputs. Here demonstrates risky scratch defects right after post poly-silicon CMP captured by DF inspection technique.
Keywords :
chemical mechanical polishing; coating techniques; etching; inspection; DF inspection; chemical mechanical polishing; dark field inspection technique; etch process; film deposition process; poly-silicon CMP process; production throughput; scratch defect; Bridges; Chemicals; Inspection; Light sources; Lighting; Sensitivity; Bright Field Inspection; Dark Field Inspection; Defect of Interest; Sensitivity; poly-silicon CMP;
Conference_Titel :
e-Manufacturing & Design Collaboration Symposium (eMDC), 2012
Conference_Location :
HsinChu
Print_ISBN :
978-1-4673-4540-8
DOI :
10.1109/eMDC.2012.6338435
