DocumentCode
1936490
Title
Dark field inspection technique on poly-silicon CMP process
Author
Chuang, Yen ; Hung, Che-Lung ; Luoh, Tuung ; Yang, Ling-Wu ; Yang, Tahone ; Chen, Kuang-Chou ; Lu, Chih-Yuan
Author_Institution
Technol. Dev. Center, Macronix Int. Co., Ltd., Hsinchu, Taiwan
fYear
2012
fDate
4-4 Sept. 2012
Firstpage
1
Lastpage
2
Abstract
Advanced high performance dark field (DF) inspection is usually utilized at larger defects and the excursions in etch, chemical mechanical polish (CMP) or film deposition processes inspection at high production throughputs. Here demonstrates risky scratch defects right after post poly-silicon CMP captured by DF inspection technique.
Keywords
chemical mechanical polishing; coating techniques; etching; inspection; DF inspection; chemical mechanical polishing; dark field inspection technique; etch process; film deposition process; poly-silicon CMP process; production throughput; scratch defect; Bridges; Chemicals; Inspection; Light sources; Lighting; Sensitivity; Bright Field Inspection; Dark Field Inspection; Defect of Interest; Sensitivity; poly-silicon CMP;
fLanguage
English
Publisher
ieee
Conference_Titel
e-Manufacturing & Design Collaboration Symposium (eMDC), 2012
Conference_Location
HsinChu
Print_ISBN
978-1-4673-4540-8
Type
conf
DOI
10.1109/eMDC.2012.6338435
Filename
6338435
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