• DocumentCode
    1936822
  • Title

    Technology constraints on VLSI processor implementation

  • Author

    Raza, A.

  • Author_Institution
    NexGen Microsyst., San Jose, CA, USA
  • fYear
    1989
  • fDate
    Feb. 27 1989-March 3 1989
  • Firstpage
    509
  • Lastpage
    512
  • Abstract
    It is shown that the critical path for the machine cycle time is determined by signals crossing the chip boundaries. The microarchitecture and logic design of processors integrated on VLSI must work within the technological constraints to perform optimal functionality with a machine cycle. With efficient pipeline control techniques the optimal pipeline depth can be chose to balance the maximum function per pipeline segment with the penalty of crossing the chip boundaries. The gate-density provided by automated ASICs (application-specific integrated circuits) is rapidly approaching what has so far been possible with extensive customization, but for the near future the highest gate-density still requires a full-custom approach. Advances in cost-effective integration have to extend to multichip packaging and board assembly. Efficient methods of cooling that can allow the VLSI chips to operate at lower temperatures can also give gains that are frequently ignored.<>
  • Keywords
    VLSI; application specific integrated circuits; circuit CAD; microprocessor chips; VLSI processor implementation; automated ASICs; chip boundaries; cooling; gate-density; logic design; machine cycle time; microarchitecture; multichip packaging; optimal functionality; pipeline control techniques; technology constraints; Application specific integrated circuits; Assembly; Automatic control; Integrated circuit packaging; Integrated circuit technology; Logic design; Microarchitecture; Optimal control; Pipelines; Very large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    COMPCON Spring '89. Thirty-Fourth IEEE Computer Society International Conference: Intellectual Leverage, Digest of Papers.
  • Conference_Location
    San Francisco, CA, USA
  • Print_ISBN
    0-8186-1909-0
  • Type

    conf

  • DOI
    10.1109/CMPCON.1989.301985
  • Filename
    301985