Millimeter wave package design: a comparison of simulation and measurement results

Author

Shan, Lei ; Meghelli, Mounir ; Kim, Joong-Ho ; Trewhella, Jean ; Taubenblatt, Marc ; Oprysko, Modest

Author_Institution

IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA

fYear

2001

fDate

2001

Firstpage

29

Lastpage

32

Abstract

A 40 Gb/s package design is introduced in this work. The package includes high-speed coaxial connectors, transmission lines on ceramic substrate, and ribbon bonds. To keep the model structure under the existing computing capability, the simulation was segmented into three sections - coaxial connector to transmission line, transmission line alone, and transmission line to ribbon bond, and then the results were assembled to predict the performance of the package. Both small signal measurements and operational tests were performed to verify the design and modeling concepts. The package was operated up to 50 Gb/s with low degradation to input digital waveforms

Keywords

packaging; 40 to 50 Gbit/s; ceramic substrate; high-speed coaxial connector; millimeter wave package design; operational testing; ribbon bond; simulation model; small-signal measurement; transmission line; Assembly; Ceramics; Coaxial components; Computational modeling; Connectors; Packaging; Predictive models; Testing; Transmission line measurements; Transmission lines;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging, 2001

Conference_Location

Cambridge, MA

Print_ISBN

0-7803-7024-4

Type

conf

DOI

10.1109/EPEP.2001.967604

Filename

967604