Title :
Characterization of via-induced parallel-plate resonances in a printed circuit board
Author :
Iwanami, M. ; Hoshino, S.
Author_Institution :
Assoc. of Super-Advanced Electron. Technol., Tsukuba, Japan
Abstract :
This paper describes the fundamental characteristics of parallel-plate resonances which are induced by the via penetrating a parallel-plate in a multilayer printed circuit board (PCB). From the results of experiments and simulations, the origin of the strong resonance peak in the |S21| characteristic is discussed. It is shown that the strong resonance peak may result from the correspondence between the parallel resonance frequencies in the input impedance of the parallel-plate and in that of the signal trace with the exception of the via
Keywords :
S-parameters; circuit resonance; circuit simulation; laminates; packaging; printed circuit testing; S21 characteristic; multilayer PCB; multilayer printed circuit board; parallel resonance frequencies; parallel-plate input impedance; parallel-plate resonances; parallel-plate via penetration; printed circuit board; resonance peak; signal trace input impedance; simulations; via-induced parallel-plate resonances; Dielectrics; Fabrication; Impedance; Large scale integration; Nonhomogeneous media; Printed circuits; Resonance; Resonant frequency; Signal design; Stacking;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2001
Conference_Location :
Cambridge, MA
Print_ISBN :
0-7803-7024-4
DOI :
10.1109/EPEP.2001.967612
