DocumentCode
1937408
Title
Wave spreading evaluation of interconnect systems
Author
Liao, Haifang ; Dai, Wayne Wei-Ming
Author_Institution
Board of Studies in Comput. Eng., California Univ., Santa Cruz, CA, USA
fYear
1993
fDate
15-18 Mar 1993
Firstpage
128
Lastpage
133
Abstract
General multiport interconnect constraints are derived and the wave spreading evaluation (WSE) approach, which uses S -parameter based network techniques to analyze coupled, multiconductor interconnect systems for high-speed analog and digital integrated circuits, is presented. WSE is based on the spreading process of voltage waves with initial spreading waves created by the initial sources. The spreading process is independent of input sources, and every step of wave spreading meets the constraints of KCL and KVL. The continual spreading of voltage waves creates accurate results. The convergence condition is always met for passive networks
Keywords
S-parameters; SPICE; circuit analysis computing; metallisation; multichip modules; multiport networks; printed circuit accessories; transmission line theory; waveform analysis; KCL; KVL; MCM; PCB; S-parameter based network techniques; SPICE; WSE method; digital integrated circuits; general multiport interconnect constraints; high speed analogue integrated circuits; lossless transmission line network; multiconductor interconnect systems; passive networks; voltage wave spreading; wave spreading evaluation approach; Coupling circuits; Distributed parameter circuits; Frequency; Integrated circuit interconnections; Multiconductor transmission lines; Performance analysis; Scattering parameters; Sparse matrices; Transmission line matrix methods; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Multi-Chip Module Conference, 1993. MCMC-93, Proceedings., 1993 IEEE
Conference_Location
Santa Cruz, CA
Print_ISBN
0-8186-3540-1
Type
conf
DOI
10.1109/MCMC.1993.302139
Filename
302139
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