DocumentCode :
1937413
Title :
Development of RF/microwave on-chip inductors using an organic micromachining process
Author :
Ramachandran, R. ; Newlin, D. ; Pham, A.
Author_Institution :
Dept. of Electr. & Comput. Eng., Clemson Univ., SC, USA
fYear :
2001
fDate :
2001
Firstpage :
97
Lastpage :
100
Abstract :
Presents the design and development of on-chip inductors using an organic micromachining process for RF and microwave applications. The process employs an SU-8 negative photoresist for developing micromachined structures using standard lithography techniques and is compatible with post-IC process to integrate passive devices onto foundry-fabricated circuits. Our initial results demonstrate that a spiral inductor fabricated on Si using this technology achieves a measured Q-factor of 20 at 2.1 GHz. Further refinement of the process and design will increase the Q-factor to 60 as predicted by electromagnetic simulations. At the meeting we will present the design and development of various inductor topologies, including gridded ground planes, for achieving high Q-factors
Keywords :
MMIC; Q-factor; UHF integrated circuits; elemental semiconductors; inductors; micromachining; photoresists; silicon; 2.1 GHz; Q-factor; RF applications; SU-8 negative photoresist; Si; electromagnetic simulations; foundry-fabricated circuits; gridded ground planes; inductor topologies; microwave applications; on-chip inductors; organic micromachining process; post-IC process; spiral inductor; standard lithography techniques; Circuits; Inductors; Lithography; Micromachining; Microwave devices; Q factor; Radio frequency; Resists; Spirals; Standards development;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Performance of Electronic Packaging, 2001
Conference_Location :
Cambridge, MA
Print_ISBN :
0-7803-7024-4
Type :
conf
DOI :
10.1109/EPEP.2001.967620
Filename :
967620
Link To Document :
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