Title :
A framework for reliability modeling of electronics
Author :
Hakim, Edward B. ; Osterman, Michael D. ; Rust, Carl A.
Author_Institution :
Army Res. Lab, Electron. & Power Sources Directorate, Fort Monmouth, NJ, USA
Abstract :
A physics-of-failure approach and the associated CADMP (computer aided design of microelectronic packages) software assist cost effective MCM (multichip module) designs scientific consideration of reliability during the design phase; evaluation of new materials, structures, and technologies; assessment of packages designed by different manufacturers; development of science-based tests, screens, and derating methods. The tools can also be used to assess reliability, of single chip package designs, including plastic encapsulated microcircuits (PEMs). The development and validation process for CADMP software continues. At present, the software is being exercised by over forty government and industry organizations, and feedback is being used to ready the software for commercialization
Keywords :
circuit CAD; integrated circuit design; integrated circuit packaging; integrated circuit reliability; multichip modules; plastic packaging; reliability theory; CADMP software; computer aided design of microelectronic packages; cost effective MCM designs; derating methods; design phase; development process; multichip module; packages; physics-of-failure approach; plastic encapsulated microcircuits; reliability modeling; screens; single chip package designs; validation process; Computer aided manufacturing; Costs; Electronics packaging; Materials reliability; Materials science and technology; Materials testing; Microelectronics; Multichip modules; Physics computing; Software packages;
Conference_Titel :
Tactical Communications Conference, 1994. Vol. 1. Digital Technology for the Tactical Communicator., Proceedings of the 1994
Conference_Location :
Fort Wayne, IN
Print_ISBN :
0-7803-2004-2
DOI :
10.1109/TCC.1994.472116
