DocumentCode
1937477
Title
Microwave frequency crosstalk model of redistribution line patterns on Wafer Level Package
Author
Sung, Mvunghee ; Kim, Narnhoon ; Lee, Junwoo ; Choi, Baekkyu ; Park, Ikseong ; Hong, Joon-Ki ; Kwon, Yongtae ; Choi, Kwang ; Kim, Joungho
Author_Institution
Terahertz Media & Syst. Lab., KAIST, Taejon, South Korea
fYear
2001
fDate
2001
Firstpage
109
Lastpage
112
Abstract
In this paper, we firstly report the crosstalk model of redistribution lines on Wafer Level Package over 5 GHz. The extracted mutual inductance and mutual capacitance have the maximum values of 220 pH/cm and 98.2 fF/cm, respectively
Keywords
capacitance; crosstalk; inductance; integrated circuit packaging; 5 GHz; microwave frequency crosstalk model; mutual capacitance; mutual inductance; redistribution line pattern; wafer level package; Capacitance; Costs; Crosstalk; Fabrication; Frequency; Inductance; Semiconductor device modeling; Semiconductor device packaging; Testing; Wafer scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 2001
Conference_Location
Cambridge, MA
Print_ISBN
0-7803-7024-4
Type
conf
DOI
10.1109/EPEP.2001.967623
Filename
967623
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